Description
Machine
Rated voltage 240V/230V/220V/110V ±10% 50Hz/60Hz
Whole device power ≤750W
Work environment: 0~40°C
Storage temperature: -20~80°C
Storage Humidity: 35%~45%
Hot air gun part
Temperature range: 100°C~480
Temperature stability: ±2°C（Static state）
Airflow type: Brushless fan gentle wind
Airflow: 120L/min (MAX)
Soldering iron part
Work voltage: 26V±10% 50Hz/60
Temperature range: 200°C~480°C
Temperature stability: ±2°C (Static state)
Tip-to-ground impedance: ＜2Ω
Tip-to-ground voltage: ＜2mV
Application
1. Suitable for a variety of elements soldering and de-soldering such as SOIC, CHIP, QFP, PLCC, BGA (especially suitable for mobile phone board and cable de-soldering).
2. For thermal shrinkage, drying, paint, adhesive removal, thawing, preheating, welding glued.
